Typical causes of hot spot or deviation of infrared camera
Common inspection site
Electronic components and components
Circuit boards and assemblies
Typical causes of temperature hot spots or deviations
Unreasonable component design
Component failure
Inappropriate welding
Trace break
Reverse polarity
Infrared cameras are widely used in the electronics industry and have proven to be very useful in the production and diagnostic fields. The ability of thermal imaging to observe small, irregular objects and remotely determine thermal characteristics and temperature is of great help to electrical engineers and technicians. Because many design and manufacturing defects present unique thermal characteristics, product design teams and quality assurance personnel can use infrared cameras to quickly identify electrical faults in the product and avoid more serious subsequent events. Whether designing a circuit board or designing a satellite, infrared cameras ensure maximum productivity, minimize time-to-market, and avoid costly recalls and warranty issues.
Application example
Printed board (PCB) production
In the design and testing phase, infrared cameras can play an important role in the production of printed boards. When designing a circuit, engineers can use infrared devices to monitor the thermal characteristics of a particular component and modify the design based on the results. During the test phase, engineers used thermal imaging to locate faults, such as improper soldering of circuits, breaks in traces between components, power fluctuations in stripped leads, missing or improper soldering components, reverse polarity of components, and incorrect component placement. And cause the circuit to heat up. The thermal mode of visualization and quantification enables engineers to improve the product and the manufacturing process.
Bare printed board (PCB) production
The bare printed board made of fiberglass and rosin must be baked in a dry oven. These printed boards typically comprise multiple layers that must be heated multiple times to cure each layer of the board. It is extremely important to increase the temperature of the board, otherwise the board may not be usable and must be discarded. Because of the low profit margins of circuit board manufacturers, this waste can seriously affect their profits. To prevent waste and profit maximization, board manufacturers use infrared cameras to carefully measure the temperature at which the board cures in order to accurately control temperature.
Wire bonding of integrated circuits
The wire bonding phase of an integrated circuit manufacturing process is referred to as a bottleneck. This is because a lot of welding, heating and cooling are involved. At what temperature the leads are soldered to the IC depends on the diameter and material of the leads. The IC manufacturer should monitor the temperature profile and the temperature before and after the leads are soldered to the IC. This allows the welding time to be adjusted based on data collected from process thermal monitoring to increase throughput. In addition, since there are fewer ICs that are damaged by heat, and there are fewer boards that are discarded due to poor soldering, waste can be reduced.
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