Compact light source for irradiation of silicon wafer UV tape

UVITRON surface light source for UV TAPES applications

In the post-silicon wafer manufacturing process, such as silicon wafer etching, silicon wafer division, etc., special UV tape (UV tape) will be used. Some manufacturers such as FURUKAWA, LINTEC have similar products. This type of UV tape has a very strong bonding strength before it receives UV radiation, sticks to the silicon wafer, and does the cutting process. After finishing cutting, using a certain amount of UV irradiation, the bonding strength immediately decreases, and the divided silicon wafers can be easily removed one by one, as shown below:

Using UVITRON INTELLI-RAY or SUNRAY series, it can irradiate silicon wafers up to 12 inches in a few seconds. There is no need for expensive semiconductor equipment. Cost-effective solution to meet the requirements of laboratory or mass production.

INTELLIRAY 400 (INTELLIRAY 600), the UVA intensity reaches 100mw / cm2 (150mw / cm2), the minimum curing area is 8 × 6inch, and the larger area can be irradiated through the distance adjustment. If it is more than 8inch silicon wafer, it is recommended to use 600W light source. The independent light source module can be installed on a bracket or a customized fixture.